Dow Electronic Materials
COPPER GLEAM™ HGX Electrolytic Copper
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| Excellent Bright Apppearance on Rolled Copper | |
 Excellent Throwing Power | |
COPPER GLEAM™ HGX Copper is a new product specially formulated for Flexible Printed Circuit Boards (FPC). It produces uniform crystal grain structure to provide a smooth plated surface on rolled copper. The 3 component additive system also allows complete control by CVS analytical method.
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Key Benefits:
- Excellent bright appearance on rolled copper
- Low internal stress
- Excellent thickness distribution
- Improved thermal shock performance
 Low Stress |