Dow Electronic Materials
CIRCUPOSIT™ LC-9100 Electroless Copper

CIRCUPOSIT™ LC-9100 Electroless Copper is an integral part of the CIRCUPOSIT PTH Low-build Electroless Copper Process, Dow Electronic Materials' unique, patented process that defines a new standard for low-build through-hole plating.

This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality.

CIRCUPOSIT LC-9100 Electroless Copper offers ease of process control operation; low cost and built- in process flexibility available to the marketplace.

Advantages:

1. Excellent coverage: on normal, high Tg, and halogen-free materials.
2. Outstanding reliability performance
3. Stable working bath; simple and safe process
4. Easy to operate/analyze, and no long activating time
5. Cost effective from less consumption, especially from Pd

Laminate	Normal Tg	Mid Tg		High Tg		Halogen Free
	S1141	IT158	TUC662	Polyclad 370HR	S1000-2	NPG
Backlight

Table 1: Excellent coverage on various laminates

Graph 1: Less Catalyst consumption contributes to cost effective