Dow Electronic Materials
COPPER GLEAM™ ST-920 Acid Copper
COPPER GLEAM™ ST-920 Acid Copper is specifically formulated for use with copper anodes and direct current (DC) rectification. The product offers excellent through-hole throwing power combined with excellent conformal microvia plating. Formulated to operate over a broad range of operation conditions, the bath offers end users with excellent production flexibility in either panel or pattern plate operation.
Key Benefits:
- Excellent throwing power for through hole and microvias, surface distribution and leveling using standard equipment and cycle times.
- Capable to work on high current density and suitable for panels up to 2.4mm thick
- Strong suppression of copper plating nodules
- Excellent deposit reliability
- Easy to operate and control, all components can be analyzed by CVS
Product Performance Photo
Through hole Throwing power > 80% for 2.4mm panel @ 20ASF (AR=8:1)
Overview |
Surface |
Hole Knee |
Hole Center |
Microvia throwing power > 80-100% @ 20ASF | Reliability by Solder Float Test | ||||||||||||||||||
125 μm Ø x 60 μm BMV |
288oC, 10sec -> RT 10sec per cycle (total 6 cycles)
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125 μm Ø x 100 μm BMV |